Solderless Breadboard MB118 10.2" x 9.4" 3,220 tie points, 4 Binding Posts, Steel Plate Backing Test Level: 0

Test Level: 0

Multifunction Module 4x 8-bit DIO´s

Product Dimensions (L x W x H): x 250 x MM

2% - 24 hrs after power-on

Capacitance: Six ranges to 5000uF

Solderless Breadboard MB118 10.2" x 9.4" 3,220 tie points, 4 Binding Posts, Steel Plate Backing Test Level: 0Solderless breadboard ideal for testing, prototyping and experimentation Contact Points: 3,220. Terminal Strips: 4. Bus Strips: 7. Binding Posts: 4. Features a sturdy steel back plate Nickel plated clips Size: 10. 2" x 9. 4" This solderless breadboard is ideal for testing, prototyping and experimentation. Features a sturdy steel back plate. Nickel plated clips. Terminal Strips: 4 Bus Strips: 7 Binding Posts: 4 Contact Points: 3,220 Size: 10. 2" x 9. 4"