Semiconductor Equipment Corp. Model 8601 Manual Die Bonder Semiconductor System 146312618263 Buffer XBP Binding Buffer –

Buffer XBP Binding Buffer – 55 mL (approximately 3/4 bottle remaining)

Manufacturer Cisco Part Number CS-KIT-S-UNIT Model Number TTC7-23 SKU 19-68236 Ref 23-97271

Includes Infrasil Window and Case as pictured

Manufacturer ZD Motor Model Number 3RK15RGN-C / 3GN 10K SKU 19-59301 Ref 23-95997

Manufacturer DBX Model Number 1531 Pro SKU 19-73618 Ref 23-105629

Semiconductor Equipment Corp. Model 8601 Manual Die Bonder Semiconductor System 146312618263 Buffer XBP Binding Buffer –This item will ship motor freight. Condition Used Description Includes: Semiconductor Equipment Corp. Model 8601 Manual Die Bonder Semiconductor System Omega DPi8 2x 8601 052 REV D Schott Fostec 20500 3x Panasonic GP KR222 Leica MZ95 Optem Controller A. G. Heinze DL 150 Gast DOA P704 AA Sylvania display Optem Stepping Motor Junction Box 30 17 74 Ushio 21V150W Halogen Reflector Lamp RadioShack 15 1982 Video Selector Dell Keyboard Viteris SPR Push